Computational-Efficient IGBT and Diode Thermal Modelling Methodology With High Accuracy
Date Issued
2025-01
Author(s) USM
DOI
10.1049/pel2.70143
Abstract
In an industrial context where high reliability is an increasingly important requirement, thermal modelling of power semiconductors becomes necessary for diagnostics and prognostics. This paper proposes a simulation-based methodology that can estimate jun
