On the Experimental Verification of Electrothermal Modeling of GaN-HEMT-Based DC-DC Converters
Date Issued
2025-04
Author(s) USM
DOI
10.1109/TPEL.2024.3514492
Abstract
The reliability of power converters is intricately tied to the variations in the junction temperature of semiconductor devices. Therefore, possessing accurate models of these components is of paramount importance. This research introduces an electrotherma
